首页> 外文会议>Infrared Technology and Applications XXXIII pt.1; Proceedings of SPIE-The International Society for Optical Engineering; vol.6542 pt.1 >Ultra Low Dark Current InGaAs Technology for Focal Plane Arrays for Low-Light Level Visible-Shortwave Infrared Imaging
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Ultra Low Dark Current InGaAs Technology for Focal Plane Arrays for Low-Light Level Visible-Shortwave Infrared Imaging

机译:用于焦平面阵列的超低暗电流InGaAs技术,用于低光水平可见-短波红外成像

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Under the DARPA Photon Counting Arrays (PCAR) program we have investigated technologies to reduce the overall noise level in InGaAs based imagers for identifying a man at 100m under low-light level imaging conditions. We report the results of our experiments comprising of 15 InGaAs wafers that were utilized to investigate lowering dark current in photodiode arrays. As a result of these experiments, we have achieved an ultra low dark current of 2nA/cm~2 through technological advances in InGaAs detector design, epitaxial growth, and processing at a temperature of +12.3℃. The InGaAs photodiode array was hybridized to a low noise readout integrated circuit, also developed under this program. The focal plane array (FPA) achieves very high sensitivity in the shortwave infrared bands in addition to the visible response added via substrate removal process post hybridization. Based on our current room-temperature stabilized SWIR camera platform, these imagers enable a full day-night imaging capability and are responsive to currently fielded covert laser designators, illuminators, and rangefinders. In addition, improved haze penetration in the SWIR compared to the visible provides enhanced clarity in the imagery of a scene. In this paper we show the results of our dark current studies as well as FPA characterization of the camera built under this program.
机译:在DARPA光子计数阵列(PCAR)计划下,我们研究了降低基于InGaAs的成像仪的整体噪声水平的技术,该技术可用于在弱光条件下识别100m处的人员。我们报告了由15个InGaAs晶片组成的实验结果,这些晶片用于研究降低光电二极管阵列中的暗电流。这些实验的结果是,通过InGaAs探测器设计,外延生长和在+ 12.3℃的温度下进行处理的技术进步,我们实现了2nA / cm〜2的超低暗电流。 InGaAs光电二极管阵列与同样在该程序下开发的低噪声读出集成电路进行了混合。焦平面阵列(FPA)除了在杂交后通过底物去除工艺增加了可见响应外,还在短波红外波段实现了很高的灵敏度。这些成像仪基于我们当前的室温稳定的SWIR摄像机平台,可实现全日夜成像功能,并对当前部署的隐蔽激光指示器,照明器和测距仪做出响应。此外,与可见光相比,SWIR中雾霾穿透性的提高提高了场景图像的清晰度。在本文中,我们显示了暗电流研究的结果以及在此程序下制造的相机的FPA表征。

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