首页> 外文会议>IFIP WG 5.5 international precision assembly seminar >Precision Assembly of Optical Backplanes
【24h】

Precision Assembly of Optical Backplanes

机译:光学背板的精密组装

获取原文

摘要

Full optical backplanes can be seen as a promising technology for high bandwidth ICT (Information and Communication Technology) apparatuses and high performance computing systems. According to a recent frame-based solution, the backplane mounts a number of independent optical interconnect circuits mainly consisting of a set of optical fiber ribbons of different lengths arranged to fulfill a specific planar ribbon routing. A non-negligible problem is related to the development of suitable techniques for the efficient and cost-effective assembly of such sub-circuits. New systems are required that combine ultimate hardware and software capabilities and derive from a synergic implementation of digital and advanced manufacturing technologies. The successful assembly of the optical interconnection circuits lies in the development of cyber-physical production systems within the framework of Industry 4.0. In this context, this work will present and discuss how different innovative technologies and consolidated technologies applied in a novel context were exploited to demonstrate the feasibility of the automated backplane assembly. The achieved results are discussed in terms of design of the work-cell layout and related equipment, simulation tests, tool path planning, and final task execution.
机译:全光背板可以看作是高带宽ICT(信息和通信技术)设备和高性能计算系统的有前途的技术。根据最近的基于帧的解决方案,背板安装了许多独立的光学互连电路,这些电路主要由一组不同长度的光纤带组成,这些光纤带被布置成满足特定的平面带状布线。不可忽略的问题与开发有效和具有成本效益的这种子电路的合适技术有关。需要新的系统,这些系统必须结合最终的硬件和软件功能,并源于数字和先进制造技术的协同实施。光互连电路的成功组装取决于工业4.0框架内网络物理生产系统的开发。在这种情况下,本工作将介绍并讨论如何利用不同的创新技术和在新环境中应用的整合技术来证明自动底板组装的可行性。在工作单元布局和相关设备的设计,模拟测试,工具路径规划和最终任务执行方面讨论了所获得的结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号