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Low-Voltage Embedded-RAM Technology: Present and Future

机译:低压嵌入式RAM技术:现在和将来

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摘要

First, key issues for low-voltage (<1V) embedded RAMs are summarized in terms of stable operation, suppression of leakage (gate-tunneling/subthreshold) currents, and speed variation of memory cells and peripheral logic circuits. Next, DRAM and SRAM cells to cope with the above issues, the circuit design focusing on subthreshold-current issue, and suppression of or compensation for design-parameter variations to reduce the speed variations are discussed. Voltage converters and power management for low-power and low-voltage operation are also explained. Finally, based on the above discussions, a perspective is given with emphasis on needs for simple/high signal-to-noise ratio memory cells (such as gain cells) with a pure logic compatible process, high-speed subthreshold-current reduction focusing on active mode, and memory-rich SoC architectures.
机译:首先,从稳定的操作,抑制泄漏(栅极隧穿/亚阈值)电流,以及存储单元和外围逻辑电路的速度变化等方面总结了低压(<1V)嵌入式RAM的关键问题。接下来,讨论了用于解决上述问题的DRAM和SRAM单元,着重于亚阈值电流问题的电路设计,以及抑制或补偿设计参数变化以减小速度变化的问题。还说明了用于低功率和低电压操作的电压转换器和功率管理。最后,基于以上讨论,给出了一种观点,重点在于对具有纯逻辑兼容过程,高速亚阈值电流降低的简单/高信噪比存储单元(例如增益单元)的需求。主动模式和内存丰富的SoC架构。

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