IN SITU MICROASSEMBLY

摘要

The 21st century sees significant breakthroughs in fabricating micro devices in the quest of miniaturising. Most micro parts have been manufactured in the range of less than 1mm. However, they are built based on material that is process dependant, resulting in monolithic parts. For example the Integrated Circuits, Micro Electro Mechanical System (MEMS) are silicon based, and on their own do not constitute a complex system that requires various functions. To pursue fully functional and miniaturised complex devices, microassembly is therefore necessary. However, microassembly processes differ from the assembly processes in the macro world. Microassembly encounters sticking effects in parts handling, adhesive forces from electrostatic attraction, van der Walls forces and surface tension . This paper envisions microassembly processes by using an innovative approach. It departs from the traditional assembly process by utilising the Projection Micro Stero Lithography, with a positioning algorithm to assemble micro parts without traditional handling and joining, named in situ microassembly process.