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The Microfabrication of Monolithic Miniaturized Ridged Half-Mode Waveguides for 5G Millimeter-Wave Communication Systems

机译:用于5G毫米波通信系统的整体式微型化脊形半模波导的微细加工

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Within this work, a novel millimeter-wave design platform is introduced, utilizing conventional microfabrication techniques to produce fully monolithic miniaturized 3D ridged half-mode waveguides. These structures offer substantial die real estate reduction compared to previously reported wafer-level waveguides, while also offering the opportunity for improvements in integration and fabrication yield. The microfabrication process flow is outlined, and a fabricated prototype is measured. A ridged half-mode waveguide is designed and fabricated with cutoff frequency of 58 GHz, for operation within E-band. The measured results show attenuation loss as low as 0.3 dB/mm, while achieving 63% miniaturization over standard rectangular monolithic 3D waveguide previously reported. Independent from the carrier substrate performance, the proposed air-filled monolithic ridged half-mode waveguide demonstrates potential to provide enhanced integration technology suitable for millimeter-wave communication.
机译:在这项工作中,引入了一种新颖的毫米波设计平台,该平台利用常规的微制造技术来生产完全单片的微型3D脊形半模波导。与先前报道的晶圆级波导相比,这些结构可显着减少管芯的占位面积,同时还提供了改善集成度和制造良率的机会。概述了微加工工艺流程,并测量了已加工的原型。设计和制造具有58 GHz截止频率的脊形半模波导,以在E波段内工作。测量结果表明,衰减损耗低至0.3 dB / mm,同时实现了先前报道的标准矩形单片3D波导的63%的小型化。与载体衬底的性能无关,拟议的充气单块脊形半模波导展示了提供适合毫米波通信的增强集成技术的潜力。

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