首页> 外文会议>IEEE Photovoltaic Specialists Conference;PVSC >Challenges of lowering solar cell production costs by reducing silver content in back side pastes
【24h】

Challenges of lowering solar cell production costs by reducing silver content in back side pastes

机译:通过减少背面浆料中的银含量来降低太阳能电池生产成本的挑战

获取原文
获取外文期刊封面目录资料

摘要

For mass production of crystalline silicon solar cells, one can adopt two schools of thought when the goal is to improve the overall value of the finished product: increasing the overall efficiency and thus power output of the finished cells, or rather provide an equal power conversion efficiency while using less costly materials to construct the cell. While the choice of either option is based in each individual business ideology, we will discuss herein how the latter goal can be achieved by reducing the costly silver usage in back contact interconnect pastes. Standard back contact patterns can have a wide variety of designs depending on the exact technology (full bus bars, solder pads, etc.); however there is the necessary evil that a considerable quantity of silver must be deposited to provide an ideal solder joint. The recent rise in the cost of silver has sparked urgency to reduce its usage, and thus this work will demonstrate that it is possible to reduce the amount of silver in back contact pastes by as much as 30% or more relative to current commercially-available pastes. As is typical of engineering new products with such large generational leaps, many challenges must be overcome to ensure that the resulting low silver containing pastes will support the long module lifetimes promised by manufacturers. These testing procedures and methods of data analysis will be discussed.
机译:对于批量生产晶体硅太阳能电池,当目标是提高成品的整体价值时,可以采用两种思路:提高整体效率,从而提高成品电池的功率输出,或者提供相等的功率转换效率更高,同时使用成本更低的材料构造电池。尽管选择哪种方法都是基于每个单独的商业意识形态,但我们将在此处讨论如何通过减少背接触式互连焊膏中昂贵的银用量来实现后一个目标。根据具体的技术(完整的母线,焊垫等),标准的背面接触图案可以具有多种设计。然而,有一个弊端是必须沉积大量的银才能提供理想的焊点。最近银价的上涨引发了减少使用银的紧迫性,因此这项工作将证明,相对于目前的市售银,可以将背接触浆料中的银含量减少多达30%或更多。粘贴。正如具有如此巨大的代际飞跃的工程新产品的典型特征一样,必须克服许多挑战,以确保所得到的低含银浆料将支持制造商承诺的较长模块寿命。将讨论这些测试程序和数据分析方法。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号