首页> 外文会议>IEEE Nordic Circuits and Systems Conference;International Symposium of System-on-Chip;NORCHIP Conference >Towards Multidimensional Verification: Where Functional Meets Non-Functional
【24h】

Towards Multidimensional Verification: Where Functional Meets Non-Functional

机译:迈向多维验证:功能与非功能相遇

获取原文

摘要

Trends in advanced electronic systems' design have a notable impact on design verification technologies. The recent paradigms of Internet-of-Things (IoT) and CyberPhysical Systems (CPS) assume devices immersed in physical environments, significantly constrained in resources and expected to provide levels of security, privacy, reliability, performance and low power features. In recent years, numerous extra-functional aspects of electronic systems were brought to the front and imply verification of hardware design models in multidimensional space along with the functional concerns of the target system. However, different from the software domain such a holistic approach remains underdeveloped. The contributions of this paper are a taxonomy for multidimensional hardware verification aspects, a state-of-the-art survey of related research works and trends towards the multidimensional verification concept. The concept is motivated by an example for the functional and power verification dimensions.
机译:先进电子系统设计的趋势对设计验证技术产生了显着影响。物联网(IoT)和网络物理系统(CPS)的最新范例假定设备浸没在物理环境中,在资源上受到极大限制,并有望提供安全性,隐私性,可靠性,性能和低功耗功能。近年来,电子系统的许多超功能方面被带到了最前沿,这意味着在多维空间中验证硬件设计模型以及目标系统的功能。但是,与软件领域不同,这种整体方法仍未得到开发。本文的贡献是多维硬件验证方面的分类法,相关研究工作的最新概况以及多维验证概念的发展趋势。该功能是通过功能和电源验证维度的示例来激发的。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号