首页> 外文会议>IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications vol.1; 20050808-12; Beijing(CN) >THE PERFORMANCE OF MICROSTRIP PATCH ANTENNAS OVER HIGH IMPEDANCE EBG SUBSTRATES WITHIN AND OUTSIDE ITS BANDGAP
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THE PERFORMANCE OF MICROSTRIP PATCH ANTENNAS OVER HIGH IMPEDANCE EBG SUBSTRATES WITHIN AND OUTSIDE ITS BANDGAP

机译:微带贴片天线在带隙内外的高阻抗EBG衬底上的性能

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摘要

Microstrip patch, antennas mounted over a high impedance EBG substrate within and outside its main bandgap are studied The structure is equivalent to a new microstrip antenna, where the conducting ground plane is replaced by a high impedance EBG layer. Initially, the bandgaps of the dielectric covered EBG structure are determined Then, patch antennas are placed over the dielectric cover and designed to work within and outside the EBG's main bandgap. Parametric studies are conducted to maximize their impedance bandwidths and gains. It is found that, very wide bandwidths of around 25 percent, can be obtained by variation of the original antenna and EBG parameters. Their gains are similarly increased. The performance of patch antenna on a single layer dielectric substrate, but surrounded by EBG patches, is also investigated Its gain could be increased significantly, but the bandwidth remained small, similar to a corresponding conventional patch antenna.
机译:研究了微带贴片,安装在其主带隙内外的高阻抗EBG衬底上的天线。该结构等效于新的微带天线,其中导电接地层被高阻抗EBG层代替。最初,确定覆盖电介质的EBG结构的带隙。然后,将贴片天线放置在电介质罩上,并设计为在EBG主带隙之内和之外工作。进行参数研究以最大化其阻抗带宽和增益。已经发现,通过改变原始天线和EBG参数可以获得大约25%的非常宽的带宽。他们的收益同样增加。还研究了单层介电基片上被EBG贴片包围的贴片天线的性能,其增益可以显着提高,但带宽仍然很小,类似于相应的常规贴片天线。

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