Performance Improvement of the LM Device for Measuring Motion Accuracy of Machining Centers

摘要

This paper describes the authors' recent work which includes: (1) Performing some improvements to make the LM device developed previously applicable to precisely assessing small size motion trajectories of machining center located on different motion planes; (2) Applying the improved device on a machining center to detect circular and linear motion trajectories within a small area, and discussing the influence of the movement size and feed rate on the motion accuracy for the tested machining center.