A Plug-and-play Condition Monitoring System for IGBT Module Bonding Wires

摘要

In the paper, a plug-and-play monitoring system is designed based on the existing monitoring method of IGBT module bonding wires fatigue. The monitoring system transmits monitoring instructions by DSPs and the host computer LabVIEW via CAN and RS-485, and obtain the required parameters via different interfaces such as junction temperature, saturated voltage drop of IGBT and monitoring current. The designed system can apply to monitoring multiple IGBT modules bonding wire fatigue and realize time sharing operation.