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Power-Management based on Reconfigurable Last-Cache level on Non-volatile Memories in Chip-Multi processors

机译:基于多芯片处理器中非易失性存储器上可重配置的最后缓存级别的电源管理

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With technology scaling and increasing parallelism levels of new embedded applications, multi-cores in chip-multiprocessors (CMP) has been increased. In this context, power consumption acts a critical issue concern in future CMPs with restricted of battery lifetime. For future CMPs architecting, 3D stacking of Last Level Cache (LLC) has been recently introduced as a new methodology to combat the performance challenges of 2D integration. However, the 3D design of LLCs incurs more leakage power utilization compared to conventional cache architectures in 2Ds due to dense integration. We present in this work a power-efficient reconfigurable hybrid last level cache architecture for future CMPs. The proposed hybrid architecture SRAM memory is incorporated with STT-RAM technology by using the characteristics for both new and traditional technologies. The experimental results show that the designed method minimizes power consumption under multi-programmed and multithreaded applications.
机译:随着技术的扩展和新嵌入式应用程序的并行性水平的提高,芯片多处理器(CMP)中的多核已经增加。在这种情况下,功耗受未来电池寿命限制在CMP中成为关键问题。对于将来的CMP架构师,最近引入了3D堆栈的最后一级缓存(LLC)作为应对2D集成性能挑战的新方法。但是,与2D中的常规缓存体系结构相比,LLC的3D设计由于密集集成而导致更多的泄漏功率利用。在这项工作中,我们为未来的CMP提供了一种高能效的可重配置混合最后一级缓存架构。通过使用新技术和传统技术的特性,建议的混合体系结构SRAM存储器与STT-RAM技术结合在一起。实验结果表明,所设计的方法在多程序和多线程应用程序下将功耗降至最低。

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