Thermal Cycling Tests of 1st Wall Mock-ups with Beryllium/CuCrZr Bonding

摘要

The innovative bonding technology between beryllium and CuCrZr with Hot Isostatic Pressing (HIP) has been proposed for the manufacturing of the ITER 1st wall. In the next step, thermal cycling tests of 1st wall mock-ups manufactured with the bonding technology, were carried out under the ITER heat load condition. The test condition is 1000 cycles of ON and OFF under 5 MW/m~2, and two types of the mock-up were manufactured for evaluation of the effects on HIP temperature (520℃ and 610℃). The tensile properties of the bonding were also evaluated in room temperature and 200℃. As for the results of the thermal cycling tests, the temperature near the bonding interface were scarcely any change up to 1000 cycles, and obvious damage of the mock-ups was not detected under the tests. As for the results of the tensile tests in 200℃, the test pieces of the HIP bonding at 610℃ were broken in parent CuCrZr material, not broken in the bonding interface.