Bare die test

摘要

The author describes a bare die test approach that uses atemporary interconnect technique overlaid on a reconstructedpseudo-wafer of individual bare dice. This overlay technique mapsdesign-specific pad locations to a standard grid that can be tested witha universal membrane probe. The proposed approach allows the developmentcost of a thin-film membrane probe to be shared across many die types,thus reducing the cost and complexity of tooling new die types. Anexperiment performed to validate this approach is described