首页> 外文会议>High-Performance Ceramics III pt.2; Key Engineering Materials; vol.280-283 >A Soft Ceramic Ti_3SiC_2 with Microscale Plasticity at Room Temperature
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A Soft Ceramic Ti_3SiC_2 with Microscale Plasticity at Room Temperature

机译:室温下具有微尺度可塑性的软陶瓷Ti_3SiC_2

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Microscale plasticity of Ti_3SiC_2 was investigated by Vickers hardness indentation. The surface layer of the hardness indentations was removed by acid solution to observe microstructure beneath the indentations, where a large number of bending, delamination and kinking grains were found. These features suggest that Ti_3SiC_2 is able to consume microdamage around the indentations. Numerous basal plane dislocations and stacking faults lying in Ti_3SiC_2 grains or accumulating at grain boundaries were observed. The basal plane dislocations play an important role in the microscale plastic deformation. The plasticity and damage tolerance for Ti_3SiC_2 at room temperature should be attributed to multiple energy absorbing mechanisms: grains bending, delamination, kink-band formation, and the basal plane slip, etc.
机译:用维氏硬度压痕法研究了Ti_3SiC_2的微观可塑性。用酸溶液除去硬度压痕的表层,观察压痕下方的微观结构,发现有大量的弯曲,分层和扭结晶粒。这些特征表明,Ti_3SiC_2能够消除压痕周围的微损伤。观察到大量的Ti_3SiC_2晶粒中或堆积在晶界的基面位错和堆垛层错。基面位错在微观塑性变形中起重要作用。 Ti_3SiC_2在室温下的可塑性和损伤耐受性应归因于多种能量吸收机制:晶粒弯曲,分层,扭结带形成和基面滑移等。

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