Electrochemical Deposition of Reactive Material Systems for Assembly and Packaging Applications

摘要

Electrochemical deposition of palladium (Pd) and tin (Sn) multilayers is presented. The multilayers are used for reactive material systems which can be used for joining. The deposition was carried out using dual bath technology (DBT) and single bath technology (SBT). For DBT different commercially available electrolytes were used. In SBT the focus is on the synthesis of a mixed electrolyte with both, Pd and Sn ions. This paper gives an overview about multilayer deposition with different electrolytes. In addition, the first results of the synthesis of a mixed Pd/Sn-electrolyte are shown.