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The practical application limits of very high power GTOs and veryhigh power bipolar transistors

机译:超高功率GA和超高功率双极晶体管的实际应用限制

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摘要

An overview is given of the practical application limitations ofnvery high power GTOs up to 2500 A ITCM and 4500 V VDRMn and very high power bipolar transistors up to 2000 A IC(CON)n and 1200 V VCEX. Some general comments are made aboutnthe limitations of medium power GTOs, transistors, Darlingtons and thencombined MOS gated charge modulated devices (e.g. insulated gatentransistors-IGTs). The latest ideas on extending the performancenenvelope of very high power GTOs and very high power bipolar transistorsnare also indicated. Because of the power loss dissipated in thesendevices which is often of the order of 1 to 2 kW when controlling highnpower at high switching frequencies it is necessary to use compressionnbonded double side cooled capsules or press packs for these devices. Notnonly forced air cooling, but also phase change (freon) and oil coolingnmay have to be employed to cope with this level of dissipation
机译:概述了高达2500 AI TCM 和4500 VV DRMn 的超高功率GTO以及高达2000 AI C的超高功率双极晶体管的实际应用局限性(CON)n 和1200 VV CEX 。关于中功率GTO,晶体管,达林顿(Darlingtons)以及组合式MOS门控电荷调制器件(例如绝缘门晶体管-IGT)的局限性,提出了一些一般性评论。还提出了有关扩展超高功率GTO和超高功率双极晶体管性能范围的最新想法。由于在传感设备中耗散的功率损耗在高开关频率下控制大功率时通常约为1到2 kW,因此有必要对这些设备使用压缩粘合的双面冷却胶囊或压力包装。一定要采用强制风冷,但也必须采用相变(氟利昂)和油冷来应对这种耗散水平

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