ELECTROLYTIC RECOVERY OF COPPER AND WATER FROM SEMICONDUCTOR INDUSTRY WASTE STREAMS

摘要

Electrodeposited copper is replacing aluminum and tungsten in the metallization of integrated circuits. Spent electrolyte, aqueous streams resulting from chemical-mechanical planarization and other waste streams must be dealt with in this new metallization technology. The paper describes an investigation of using electrodeposition to remove copper from such aqueous streams. The rotating disc electrode has been used to examine the effect of additives encountered in these streams on deposition kinetics. One possible practical electrode for this application is the porous carbon electrode. Experiments have been conducted to demonstrate that copper can be deposited into such electrodes but the performance is dependent on pore structure and the presence of additives.