Laser Diode based Pseudo-Heterodyne Interferometer for on-line Process Control of Wire Bonders

摘要

Ultrasonic bonding is one of the key technologies for the semiconductor industry. The level to which the process is understood determines how well the reliability and yield of the end product can be optimised. Ideal bond results can only be obtained when the diverse material and process control parameters are perfectly tuned to one another. One particularly important parameter is the ultrasonic energy during the different phases of the bond process. For this reason, the bonding industry is very interested in finding an active bond process control system to optimise the bond performance.