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Temperature stability of the IBM-formed CdxHg1-xTe p-n structure

机译:IBM形成的CdxHg1-xTe p-n结构的温度稳定性

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Abstract: The influence of thermal annealing on electrical properties of the p-n structures formed by ion beam milling (IBM) on usually vacancy doped Cd$-x$/Hg$-1$MIN@x$/Te single crystals with p(77K) $EQ 5.8 $MUL 10$+15$/ cm$+$MIN@3$/ was investigated. After IBM of the initial samples the n-type layers were created with the thickness about 10 $mu and electron concentration of the mane part of n-type layers 5 $MUL 10$+14$/ cm$+$MIN@3$/. P-n structures were annealed on air at 85, 120 and 160 degrees C during 1, 2 and 4 hours. Degradation of the p-n structure after every annealing step was estimated on changes of the Hall coefficient magnetic field dependence. It was revealed that degradation of the p- n structure took place due to progressive thickness decreasing of n-layer through Hg passing to intersites and vacancy creation. The critical temperature during technology steps is equal about 100 degrees C. !8
机译:摘要:热退火对离子束铣削(IBM)形成的pn结构的电学性能的影响通常是空位掺杂p(77K)的Cd $ -x $ / Hg $ -1 $ MIN @ x $ / Te单晶$ EQ 5.8调查了$ MUL 10 $ + 15 $ / cm $ + $ MIN @ 3 $ /。在初始样本的IBM之后,创建的n型层的厚度约为10μmu,n型层的鬃毛部分的电子浓度为5 $ MUL 10 $ + 14 $ / cm $ + $ MIN @ 3 $ / 。将P-n结构在空气中分别在85、120和160摄氏度下退火1、2和4个小时。根据霍尔系数磁场依赖性的变化,估计每个退火步骤后p-n结构的退化。揭示了由于通过传递到位点之间的汞和空位的产生使n层厚度逐渐减小,导致了p-n结构的降解。工艺步骤中的临界温度大约等于100摄氏度!8

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