首页> 外文会议>The Fourth Asian Conference on Heat Treatment and Surface Engineering(第四届亚洲热处理及表面工程大会) >Microstructure Evolution and Precipitates Transformation in a Duplex Stainless Steel Bond Brazed with a Ni-B-Si Foil
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Microstructure Evolution and Precipitates Transformation in a Duplex Stainless Steel Bond Brazed with a Ni-B-Si Foil

机译:Ni-B-Si箔钎焊双相不锈钢焊缝中的组织演变和析出相转变

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MBF-35 (Ni-7.3Si-2.2B (wt.%)) was selected as a filler alloy for brazing of a duplex stainless steel conducted at the temperature range of 1060-1090 ℃ with various times from 60 s to 3600 s. The experimental results revealed that there was no significant grain growth of ferrite and austenite in the base metal. The precipitation of σ phase was not found in any of the brazed bonds. The results also indicated, prior to completion of isothermal solidification, BN and Ni3Si appeared in the brazing-affected zone and the bonded interlayer, respectively. The noted enrichment of Ni and Fe was detected in the brazing-affected zone. At 1060 ℃ and 1090 ℃ after 2700 s and 900 s, respectively, the isothermal solidification of the melt was completed at the center of the joints. The brazing was finished within 1200 s and 3600 s, respectively. The SEM and EPMA results also showed the transformation of secondary-phase precipitates from BN to BN and (N, Mo) boride and further to BN at the interface with increasing holding time. This transformation appeared to be largely due to the change in N composition with increase of holding time at the interface. BN precipitate was not removed in terms of the increased holding time at the bonding temperature. The formation of Ni3Si and BN was responsible for the appearance of hardness peak values in the joint area.
机译:选择MBF-35(Ni-7.3Si-2.2B(wt。%))作为钎焊双相不锈钢的填充合金,在1060至1090℃的温度范围内进行60 s至3600 s的不同时间焊接。实验结果表明,母材中铁素体和奥氏体没有明显的晶粒长大。在任何钎焊键中均未发现σ相沉淀。结果还表明,在等温凝固完成之前,BN和Ni3Si分别出现在钎焊影响区和键合中间层中。在钎焊影响区中检测到明显富集的镍和铁。分别在2700 s和900 s后分别在1060℃和1090℃,熔体的等温凝固在接头中心完成。钎焊分别在1200 s和3600 s内完成。 SEM和EPMA结果还表明,随着保持时间的增加,第二相沉淀物在界面处从BN转变为BN和(N,Mo)硼化物,进而转变为BN。这种转变似乎主要归因于N组成随界面保持时间的增加而变化。就在结合温度下增加的保持时间而言,没有除去BN沉淀物。 Ni3Si和BN的形成是在接头区域出现硬度峰值的原因。

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