首页> 外文会议>First European Workshop on Structural Health Monitoring 2002, Jul 10-12, 2002, Cachan (Paris), France >Study of the Interaction Between Bonded Piezo-Electric Devices and Plates
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Study of the Interaction Between Bonded Piezo-Electric Devices and Plates

机译:压电压电器件与板之间相互作用的研究

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摘要

Thin and small piezo-electric discs may be used in health-monitoring systems for composite plates. Before using them in actual systems, it is needed to prove that they do not initiate delaminations and that they are not damaged by service loadings, in particular fatigue loadings. Experiments has been done showing that if they are sufficiently small and thin, the compressive strength is not modified and that they can sustain cyclic fatigue loadings. Moreover, it is proved that the electric impedance of bonded disc can be use to check the quality of the bonding between the host structure and the discs.
机译:薄而小的压电盘可用于复合板的健康监测系统。在实际系统中使用它们之前,需要证明它们不会引发分层,并且不会受到服务负载(尤其是疲劳负载)的损坏。已经进行的实验表明,如果它们足够小且薄,则抗压强度不会改变,并且它们可以承受周期性疲劳载荷。此外,已经证明,结合盘的电阻抗可以用于检查主体结构和盘之间的结合质量。

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