A New Compact 3-D Hybrid Coupler Using Multi-Layer Microstrip Lines at 15 GHz

摘要

This paper presents a new compact 90° hybrid coupler using thin-film microstrip and inverted microstrip lines for monolithic microwave integrated circuit (MMIC) applications. In order to reduce an intrinsic circuit area of the hybrid coupler, a compact meandered line configuration and a new multi-layer structure design have been adopted. The configuration and structural dimensions of the multi-layer structure were designed and investigated through detailed 3-D electro-magnetic simulations. The proposed 3-D hybrid coupler was realized using a developed benzocyclobutene (BCB)-based multi-layer MMIC technology. The intrinsic area of the fabricated 3-D hybrid coupler is significantly reduced compared to that of a conventional hybrid coupler using the 2-D meandered line configuration.