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Tunable Dielectric Material Embedded in LTCC for GHz-Frequency-Range Applications

机译:嵌入LTCC的可调谐介电材料,用于GHz频率范围的应用

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Tunable dielectric materials offer an opportunity to realize novel wireless broadband applications such as antenna arrays with electrically controlled propagation delays. This kind of devices with good performance are already realized using discrete components such as diodes or barium strontium titanate (BST) thin films [1-2]. In the first case, however, extra assembling is required whereas with thin films, the production of the component can be expensive in large volumes. One promising method to exploit tunable dielectric materials is to make them compatible to LTCC (Low Temperature Co-fired Ceramics) process, thus enabling inexpensive and flexible manufacturing of functional multilayer ceramic modules (MCMs) for telecommunication industry. Barium strontium titanate with low sintering temperature (~900 ℃) has already been investigated for the LTCC process [3-4]. Additionally, first attempts to integrate it with other LTCC materials have been reported [5]. However, further research to enable a reliable co-firing process is needed since different materials have different shrinkages and thermal expansions easily causing delamination of the layers or warping of the whole module during sintering. In this work, a detailed research of the integration and interaction of the LTCC compatible BST layers with dielectric LTCC layers is presented. For process development, Pressure Assisted Sintering (PAS) is considered to enable flat multilayer multimaterial modules. Additionally, the effects of co-firing on relative permittivity and loss of the BST are reported as well as the temperature dependence of the relative permittivity (20 ℃-400 ℃).
机译:可调介电材料为实现新型无线宽带应用提供了机会,例如具有电控传播延迟的天线阵列。这类性能良好的设备已经使用分立组件(例如二极管或钛酸钡锶(BST)薄膜)实现了[1-2]。然而,在第一种情况下,需要额外的组装,而对于薄膜,该组件的生产在大批量中可能是昂贵的。开发可调谐介电材料的一种有前途的方法是使它们与LTCC(低温共烧陶瓷)工艺兼容,从而能够廉价,灵活地制造用于电信行业的功能多层陶瓷模块(MCM)。低烧结温度(〜900℃)的钛酸锶钡已经被用于LTCC工艺[3-4]。另外,已经报道了将其与其他LTCC材料集成的首次尝试[5]。但是,由于不同的材料具有不同的收缩率和热膨胀,容易导致层的分层或整个模块在烧结过程中的翘曲,因此需要进行进一步的研究以实现可靠的共烧工艺。在这项工作中,将对LTCC兼容的BST层与介电LTCC层的集成和相互作用进行详细研究。对于工艺开发,考虑采用压力辅助烧结(PAS)来实现扁平多层多材料模块。此外,还报道了共烧对相对介电常数和BST损耗的影响,以及相对介电常数(20℃-400℃)的温度依赖性。

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