Minimising thermal cracking for laser cutting of ceramics, by implementing a closed-loop control system

摘要

Laser cutting of ceramics has only been industrially established for material thicknesses below 2 mm. As the thickness increases, the thermal shock caused by the laser beam induces thermal cracking. This greatly limits the laser-based cutting processes for ceramics. This paper describes how thermal cracking can be reduced. The research is based on using a closed-loop control system to guarantee a stable process emission and by this a stable process. By this method it is possible to reduce the thermal cracking effect while maintaining an acceptable cutting speed.