Tailoring Crimp Patterns of Electrospun Fibers by Using Thermal Shrinkage

摘要

PA fibers with crimp patterns were successfully fabricated in a very simple manner by controlled thermal shrinkage. The degree of crimp (amplitude and wavelength) was adjusted by the shrinkage extent of PLA films and the control of crimped patterns can be tailored by the thickness of the elctrospun meshes. Furthermore, crimped structures improved hMSCs penetration into scaffolds and showed potential to be used in tendon and ligament engineering.