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A SPLIT-FLUX MODEL FOR PHONON TRANSPORT NEAR HOTSPOTSq

机译:HOTSPOTSq附近的声子传输的分裂通量模型

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摘要

Intense electron-phonon scattering near the peak electric field in a semiconductor device results in nanometer-scale phonon hotspots with power densities on the order of 1 W/μm~3. To study the impact of the hotspot on phonon transport, we solve the phonon Boltzmann transport equation under the relaxation time approximation to yield the departure from equilibrium amongst phonon modes. The departure function is split into two contributions: one arising from the far-from-equilibrium emitted phonons and the other from the near-equilibrium thermal phonons. The model predictions are compared with existing data on ballistic phonon transport in silicon. Computations of transient and steady state phonon occupation numbers for a device geometry show the predominance of longitudinal optical phonons for electric fields on the order of 1 MV/m. Due to the low group velocity of these modes, there is an energy stagnation at the hotspot which results in an excess temperature rise of about 13% for a 90 nm bulk silicon device. During device switching, emitted phonons have sufficient time to relax completely when the duty cycle is 30% on a period of 100ps.
机译:半导体器件中靠近峰值电场的强烈电子声子散射会导致功率密度约为1 W /μm〜3的纳米级声子热点。为了研究热点对声子输运的影响,我们在松弛时间近似下求解了声子玻耳兹曼输运方程,以求出声子模之间的平衡偏离。偏离函数分为两部分:一类来自远离平衡发射的声子,另一类来自接近平衡热声子。将模型预测与硅中弹道声子传输的现有数据进行比较。器件几何结构的瞬态和稳态声子占有数的计算表明,纵向光学声子在电场中的优势约为1 MV / m。由于这些模式的低群速度,在热点处存在能量停滞,这导致90 nm体硅器件的温度升高约13%。在设备切换期间,当占空比为30%(在100ps的时间内)时,发出的声子具有足够的时间完全放松。

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