首页> 外文会议>Electromagnetic Compatibility Symposium - Perth (EMCSA), 2011 >How decoupling capacitors may cause radiated EMI
【24h】

How decoupling capacitors may cause radiated EMI

机译:去耦电容器如何引起辐射EMI

获取原文
获取原文并翻译 | 示例

摘要

This paper analyzes effects that decoupling capacitor(s) may have on the development of radiated emissions should improper implementation on a printed circuit board (PCB) occur. This applied EMC paper is based on real-world experience and contains an easy solution to help engineers achieve compliance quickly and at low cost, without having to redesign the PCB. Improper implementation of decoupling capacitor(s) includes: routing traces on the outer layers or using boards with or without power and return planes; excessive inductance in the decoupling loop area; lack of charge storage to replenish the power and return planes; and self-resonant frequency of the capacitor outside the harmonic spectrum of periodic signals. We analyze the magnitude of radiated electromagnetic interference (EMI) based on physical placement of decoupling capacitors from digital components and whether distance spacing from a switching element, connected by routed traces on both the top and bottom of a PCB, makes a significant difference in the development and propagation of radiated emissions. The focus is on what occurs on a PCB, regardless of whether the board is single-sided, double-sided or multilayer.
机译:本文分析了在印刷电路板(PCB)实施不当的情况下,去耦电容器对辐射发射的影响。这份基于EMC的应用论文基于实际经验,包含一个简单的解决方案,可帮助工程师快速,低成本地实现合规性,而无需重新设计PCB。去耦电容器的不正确实现包括:在外层上走线,或者使用带或不带电源和返回平面的电路板;去耦环路区域中的电感过大;缺乏电荷存储来补充电源和返回平面;周期信号谐波频谱之外的电容器的自谐振频率。我们根据去耦电容器与数字元件的物理位置以及通过PCB顶部和底部的布线走线连接的开关元件之间的距离间距是否对PCB的显着差异进行了分析,从而分析了辐射电磁干扰(EMI)的大小。辐射发射的发展和传播。重点在于PCB上发生的情况,无论该板是单面,双面还是多层。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号