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Wet Chemical Etching of Wide Bandgap Semiconductors-GaN, ZnO and SiC

机译:宽带隙半导体-GaN,ZnO和SiC的湿法化学蚀刻

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摘要

Wide bandgap semiconductors have many properties that make them attractive for high power, high temperature device applications. In this paper we review wet etching of three important materials, namely ZnO, GaN and SiC. While ZnO is readily etched in many acid solutions including HNO_3/HCI and HF/HNO_3, and in the nonacid acetyleacetone, the group III nitrides and SiC are very difficult to wet etch and generally dry etching is used. Various etchants for GaN and SiC have been investigated, including aqueous mineral acid and base solutions, and molten salts. Wet etches have a variety of applications to wide bandgap semiconductor technology, including defect decoration, polarity and polytype (for SiC) identification by producing characteristic pits or hillocks, and device fabrication on smooth surfaces. Electrochemical etching is successful at room temperature in some situations for GaN and SiC. In addition, photo-assisted wet etching produces similar rates independent of crystal polarity.
机译:宽带隙半导体具有许多特性,使其对于高功率,高温器件应用具有吸引力。在本文中,我们回顾了三种重要材料的湿法蚀刻,即ZnO,GaN和SiC。尽管ZnO易于在包括HNO_3 / HCl和HF / HNO_3在内的许多酸性溶液中进行蚀刻,而在非酸性乙酰丙酮中,但III型氮化物和SiC很难进行湿法蚀刻,通常使用干法蚀刻。已经研究了用于GaN和SiC的各种蚀刻剂,包括无机酸水溶液和碱溶液以及熔融盐。湿法刻蚀在宽带隙半导体技术中具有多种应用,包括缺陷装饰,极性和通过产生特征性凹坑或小丘来识别多型(用于SiC)以及在光滑表面上制造器件。在某些情况下,对于GaN和SiC,电化学蚀刻在室温下是成功的。另外,光辅助湿法蚀刻产生的速率与晶体极性无关。

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