Packaging education for the 21st century

摘要

Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning.