A study on adhesive properties of a damascene electroplated Cu composite sheet

摘要

In this paper, it was aimed to develop a new interconnect material having high electrical conductivity and strength simultaneously. The Cu composite sheet, possessing mesh type Ag conduction paths on the surface of a high strength Cu alloy sheet, was manufactured by damascene electroplating. The peel strength of Cu composite sheet prepared by damascene electroplating increased by above 50 times compared to Cu composite sheet by conventional electroplating. Al wire wedge bonding was able to be successfully conducted without extra metal thin film coating.