Application-specific integrated processing for ULSI

摘要

Abstract: ULSI device manufacturing requires capital equipmentmanufacturers to deliver state-of-the-art performance,particle- free process environments, and high uptime.With critical dimensions of 0.5 $mu and below,essentially perfect etching results are required tomeet device requirements. Gate structures, once simplepoly-si types, are now multiple films of poly-si plussilicide. Contact hole etching to silicon requiresdamage free and polymer free surfaces following etch.Metallizations, once single aluminum alloy films, arenow complex refractory metal/aluminum/refractory metalsandwiches. Multiple etch steps are required tosuccessfully process these layers. Drytek hasmanufactured integrated process equipment for the pastsix years. To meet the demand for ULSI, Drytek hasdeveloped the ASIQ$+TM$/, or Application SpecificIntegrated Quad. Our paper discusses the benefits ofthe ASIQ$+TM$/ system concept for complex etchapplications, where the use of different plasma sourceson the same integrated process platform is required fornear perfect etching results of ULSI devices.!14