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Modification of angular photoresponse of InGaAsN-based photodiode with 3D woodpile structures

机译:带有3D木桩结构的InGaAsN基光电二极管角光响应的修正

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In this paper we present modification of angular photoresponse of InGaAsN-based photodiode with applied polymer (IP-DIP) three-dimensional (3D) woodpile structure. 3D woodpile structure was prepared as effective diffractive element for using in optoelectronic devices with possibility of direct application on a chip surface. 3D woodpile structure was prepared using laser lithography by direct laser writing process. The effect of woodpile structure on angular photoresponse structure was investigated from goniophotometer measurements. Spatial modulation of light coupling into the photodiode chip with applied 3D woodpile structure was documented for irradiation by broad-band green light.
机译:在本文中,我们介绍了应用聚合物(IP-DIP)三维(3D)木桩结构对基于InGaAsN的光电二极管的角光响应的修改。制备3D木桩结构作为有效的衍射元件,可用于光电器件中,并有可能直接应用于芯片表面。通过直接激光写入工艺,使用激光光刻技术制备3D木桩结构。从测角光度计的测量研究了木桩结构对角型光响应结构的影响。记录了耦合到具有应用3D木桩结构的光电二极管芯片中的光的空间调制,以用于宽带绿光的照射。

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