首页> 外文会议>Conference on VCSELs and Optical Interconnects Oct 30-Nov 1, 2002 Brugge, Belgium >Coupling of optoelectronic modules to optical layer in printed circuit boards (PCBs)
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Coupling of optoelectronic modules to optical layer in printed circuit boards (PCBs)

机译:光电模块到印刷电路板(PCB)中光学层的耦合

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摘要

For coupling of light into and out of the optical layer in electric-optical printed circuit boards (PCBs) a scheme for a perpendicular coupling of the light with respect to the waveguide layer is presented. The required 90°light deflection is accomplished by integrated silver-coated 45°micro mirrors which are moulded into polymer substrate together with the waveguide grooves. Exact alignment of the optoelectronic modules with respect to the mirrors is obtained by holes in the waveguide layer and MT pins in the OE-modules.
机译:为了将光耦合进出电光印刷电路板(PCB)中的光学层,提出了一种用于使光相对于波导层垂直耦合的方案。所需的90°光偏转是通过集成的镀银的45°微镜实现的,该镜与波导凹槽一起模制成聚合物基板。光电模块相对于反射镜的精确对准是通过波导层中的孔和OE模块中的MT引脚实现的。

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