首页> 外文会议>Conference on Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII Apr 21-22, 2003 Orlando, Florida, USA >MIRAGE: Developments in IRSP System Development, RIIC Design, Emitter Fabrication, and Performance
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MIRAGE: Developments in IRSP System Development, RIIC Design, Emitter Fabrication, and Performance

机译:MIRAGE:IRSP系统开发,RIIC设计,发射器制造和性能方面的发展

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SBlR's family of MIRAGE infrared scene projection systems is undergoing significant growth and expansion. SBIR has completed the transition of Honeywell's resistive emitter technology to MCNC Research and Development Institute (MCNC-RDI), and is preparing for first-lot production of IR emitters in support of ongoing programs. Development of MIRAGE resistive emitter-based products is underway in order to increase maximum scene temperature, decrease radiance rise time, and improve overall operation. The 1024 x 1024 Large Format Resistive Array (LFRA) Read-In Integrated Circuit (RIIC) has been fabricated and tested, with emitter fabrication to start in mid-2003. A next-generation MIRAGE II (512 x 512) RIIC is also ready for fabrication, in support of high-performance MIRAGE II 512 x 512 systems providing greater than 750 K MWIR apparent temperature, and less than 5 ms 10-90% MWIR radiance rise time. In support of these new technologies and products, SBIR has developed test equipment and facilities for use in next-generation MIRAGE device wafer probing, test, evaluation, diagnostic, and assembly processes.
机译:SBlR的MIRAGE红外场景投影系统系列正在经历显着的增长和扩展。 SBIR已完成了霍尼韦尔(中国)的电阻发射器技术向MCNC研究与开发研究院(MCNC-RDI)的过渡,并正在为支持正在进行的计划而批量生产IR发射器做准备。目前正在开发基于MIRAGE电阻发射器的产品,以提高最高场景温度,减少辐射上升时间并改善整体运行。 1024 x 1024大型电阻阵列(LFRA)读入式集成电路(RIIC)已经过制造和测试,发射极的制造将于2003年中期开始。下一代MIRAGE II(512 x 512)RIIC也已准备好进行制造,以支持高性能MIRAGE II 512 x 512系统,该系统可提供大于750 K MWIR的表观温度和小于5 ms的10-90%MWIR辐射上升时间。为了支持这些新技术和产品,SBIR开发了用于下一代MIRAGE器件晶圆探测,测试,评估,诊断和组装过程的测试设备和设施。

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