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Micro Stereo Lithography for 3D MEMS devices

机译:适用于3D MEMS器件的微立体光刻

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Micro Stereo Lithography (MSL) is a poor man's LIGA for fabricating high aspect ratio MEMS devices in UV curable semiconducting polymers using either two computer-controlled low inertia galvanometric mirrors with the aid of focusing lens or an array of opical fibers. This technique has also been successfully used recently for fabricating 3D metallic and ceramic MEMS devices. Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limtations have nevertheless to be underlined: 1) these techniques are very expensive and need spcific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to 'look' for alternative methods to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers. These multifunctional polymers have not only a high sensing capability but also a high strain and actuation performance. With the invention of organic thin film transistor, now it seems possible to fabricate polymeric based MEMS devices with built-in-electronics. Moreover, with combined architecture techniques, one can integrate silicon devices with the polymeric ones without much difficulty. In this paper, the applications of MSL for polymer and ceramic based microstructures and MEMS are discussed with some examples.
机译:微型立体光刻(MSL)是穷人的LIGA,可使用两个计算机控制的低惯性振镜借助聚焦透镜或光纤阵列在UV可固化半导体聚合物中制造高纵横比MEMS器件。最近,该技术也已成功用于制造3D金属和陶瓷MEMS器件。目前用于构思MEMS的诸如批量微机械加工和表面微机械加工之类的微加工技术很大程度上源自标准IC和微电子技术。尽管通过使用传统的微加工技术已经实现了许多具有集成电子器件的MEMS器件,但仍然需要强调一些局限性:1)这些技术非常昂贵,需要特定的安装以及洁净室环境; 2)可以使用的材料到目前为止,只能用于硅和金属; 3)无法制造具有曲面或重要层数的3D零件。而且,对于某些生物应用,用于传感器的材料必须与人体兼容,并且致动器需要具有高应变和位移,这是当前的基于硅的MEMS无法提供的。因此,研究人员自然会“寻找”使用聚合物基材料制造3D传感器和执行器的替代方法。为了使MSL技术成功地成为硅技术的对手,必须提出一种多功能聚合物。这些多功能聚合物不仅具有高感测能力,而且具有高应变和致动性能。随着有机薄膜晶体管的发明,现在似乎可以制造具有内置电子的基于聚合物的MEMS器件。而且,利用组合的架构技术,可以将硅器件与聚合物器件集成在一起而没有太多困难。本文通过一些实例讨论了MSL在基于聚合物和陶瓷的微结构以及MEMS中的应用。

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