首页> 外文会议>Conference on Photonics: Design, Technology, and Packaging; Dec 10-12, 2003; Perth, Australia >Application of combinatorial material chip method on the improvement of quantum dots emission efficiency
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Application of combinatorial material chip method on the improvement of quantum dots emission efficiency

机译:组合材料芯片法在提高量子点发射效率中的应用

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The combinatorial material chip method has been used to study the emission efficiency of InAs/GaAs quantum dots. The photoluminescence spectroscopy is performed to obtain the rule of emission efficiency on the proton implantation dose. A pronounced enhancement of room temperature emission efficiency has been obtained by the optimized quantum dots process condition. The increment of emission efficiency up to 80 times has been observed. This effect may be resulted from both the proton passivation and carrier capture enhancement effects. The maximum photoluminescence peak shift is about 23 meV resulted from the intermixing of quantum dots. A linear dependence behavior has been observed for both the non-radiative recombination time and carrier relaxation time on the ion-implantation dose. The maximum enhancement of the photoluminescence is observed in the proton implantation dose of 1.0x10~(14) cm~(-2) followed by rapid thermal annealing at 700 ℃. These effects will be useful for the QDs' optoelectronic devices.
机译:组合材料芯片方法已经被用于研究InAs / GaAs量子点的发射效率。进行光致发光光谱法以获得质子注入剂量的发射效率规则。通过优化的量子点工艺条件,可以显着提高室温发射效率。观察到发射效率提高了80倍。该效应可能是由于质子钝化和载流子捕获增强效应两者引起的。由量子点的混合导致的最大光致发光峰位移约为23meV。对于非辐射复合时间和载流子弛豫时间,已经观察到了离子注入剂量的线性依赖性行为。质子注入剂量为1.0x10〜(14)cm〜(-2),随后在700℃快速热退火,观察到最大的光致发光增强。这些效应对于量子点的光电器件将是有用的。

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