首页> 外文会议>Conference on Machine Vision and Three-Dimensional Imaging Systems for Inspection and Metrology 7-8 November 2000 Boston, USA >Scaling a 3D vision system from automobiles down to circuit board inspection: issues in small field of view inspection
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Scaling a 3D vision system from automobiles down to circuit board inspection: issues in small field of view inspection

机译:将3D视觉系统从汽车扩展到电路板检查:小视野检查中的问题

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摘要

A look at the challenges surrounding the modification of a large field of view system (6"-18") for small field of view (approx0.5") inspection in the electronics industry. Camera-based 3D systems suffer serious losses in depth of field when attempting to look at small fields of view. Off axis lens placement and careful application of the Scheimpflug Rule can significantly improve any camera-based inspection system, but these improvements may require modifications in your camera calibration procedures. A manufacturing inspection application and the improvements brought about by these techniques are discussed along with the pitfalls that were encountered along the way.
机译:着眼于围绕电子行业中的小视场(约0.5英寸)检查的大视场系统(6“ -18”)的修改所面临的挑战。基于摄像头的3D系统在深度成像方面遭受了严重损失尝试在小视野范围内观察时,离轴透镜的放置和Scheimpflug规则的仔细应用可以显着改善任何基于相机的检查系统,但是这些改进可能需要修改相机的校准程序。讨论了这些技术带来的改进以及在此过程中遇到的陷阱。

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