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New Perfluoroelastomers for Semi-Conductor Applications

机译:适用于半导体应用的新型全氟弹性体

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摘要

Perfluoroelastomers are designed for high demanding applications. In order to fulfill the new needs of high performances requested by the market, new technologies able to produce tailor-made perfluoroelastomers should be developed. In the present paper a new perfluoroelastomer Tecnoflon~R PFR 5910M filled with a special semi-crystalline perfluoropolymer filler is presented. Usually, the polymeric filler is polytetrafluoroethylene (PTFE). This compound is obtained either by a special core-shell polymerization or by co-coagulation of the perfluoroelastomer latex and a PTFE latex with polymer particles below 100 nm. This new technology, developed by Ausimont, allows the preparation of translucent PTFE based perfluoroelastomer items with good final properties for wet and dry semiconductor application. Furthermore in order to increase the thermal resistance of the polymer network a new curing agent, namely a fluorinated di-olefin, is used in the curing of the new PTFE-filled perfluoroelastomer.
机译:全氟弹性体专为高要求应用而设计。为了满足市场所要求的高性能的新需求,应该开发能够生产定制全氟弹性体的新技术。本文提出了一种新型的全氟弹性体Tecnoflon〜R PFR 5910M,其中填充了一种特殊的半结晶全氟聚合物填料。通常,聚合物填料是聚四氟乙烯(PTFE)。该化合物可通过特殊的核-壳聚合或全氟弹性体胶乳和PTFE胶乳与低于100 nm的聚合物颗粒的共凝结而获得。 Ausimont开发的这项新技术允许制备具有良好最终特性的半透明PTFE基全氟弹性体,适用于干湿半导体应用。此外,为了增加聚合物网络的耐热性,在新的填充PTFE的全氟弹性体的固化中使用了一种新的固化剂,即氟化二烯烃。

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