首页> 外文会议>Conference on European Micro and Nano Systems(EMN04): First Issue Advances amp; Applications for Micro amp; Nano Systems; 20041020-21; Paris(FR) >NANODAC- AN SPM-BASED NANODEFORMATION MEASUREMENT TECHNIQUE FOR RELIABILITY ASSESSMENT OF MICRO- AND NANOSYSTEMS
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NANODAC- AN SPM-BASED NANODEFORMATION MEASUREMENT TECHNIQUE FOR RELIABILITY ASSESSMENT OF MICRO- AND NANOSYSTEMS

机译:NANODAC-一种基于SPM的纳米变形测量技术,用于微系统和纳米系统的可靠性评估

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With the development of micro- and nanotechnological products such as sensors, MEMS/NEMS and their broad application in a variety of market segments new reliability issues will arise. The increasing interface-to-volume ratio in highly integrated systems and nanoparticle filled materials and unsolved questions of size effect of nanomaterials are challenges for experimental reliability evaluation. Therefore the authors developed the nanoDAC method (nano Deformation Analysis by Correlation), which allows the determination and evaluation of 2D displacement fields based on Scanning Probe Microscopy (SPM) data. In-situ SPM scans of the analyzed object are carried out at different thermo-mechanical load states. The images are compared utilizing grayscale cross correlation algorithms. This allows the tracking of local image patterns of the analyzed surface structure. The measurement results of the nanoDAC technique are full-field displacement and strain fields. Due to the application of SPM equipment deformations in nanometer range can be easily detected. The method can be performed on bulk materials, thin films and on devices i.e microelectronic components, sensors or MEMS/NEMS. Furthermore, the mechanical characterization of material interfaces can be carried out with highest precision.
机译:随着诸如传感器,MEMS / NEMS的微纳米技术产品的发展及其在各种市场领域的广泛应用,将会出现新的可靠性问题。在高度集成的系统和纳米颗粒填充材料中不断增加的界面体积比,以及纳米材料尺寸效应尚未解决的问题,是进行实验可靠性评估的挑战。因此,作者开发了nanoDAC方法(通过关联进行纳米变形分析),该方法可以基于扫描探针显微镜(SPM)数据确定和评估2D位移场。在不同的热机械负载状态下对被分析的对象进行原位SPM扫描。使用灰度互相关算法比较图像。这允许跟踪所分析的表面结构的局部图像图案。 nanoDAC技术的测量结果是全场位移和应变场。由于使用了SPM设备,可以很容易地检测出纳米范围的变形。该方法可以在块状材料,薄膜和设备上执行,例如微电子部件,传感器或MEMS / NEMS。此外,材料界面的机械表征可以最高精度进行。

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