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A Spectral Stochastic Collocation Method for Capacitance Extraction of Interconnects with Process Variations

机译:具有过程变化的互连线电容提取的谱随机配置方法

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In this paper, a spectral stochastic collocation method (SSCM), is proposed for the capacitance extraction of interconnects with either on-chip process variations or off-chip rough surfaces. The proposed method is based on the stochastic spectral method c
机译:在本文中,提出了一种频谱随机配置方法(SSCM),用于具有片上工艺变化或片外粗糙表面的互连的电容提取。所提出的方法基于随机频谱方法c

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