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Advancing quasi-freestanding epitaxial graphene electronics through integration of wafer scale hexagonal boron nitride dielectrics

机译:通过集成晶圆级六角形氮化硼电介质来推进准独立外延石墨烯电子产品

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A key limitation to graphene based electronics is graphene’s interaction with dielectric interfaces. SiOsub2/sub andvarious high-k gate dielectrics can introduce scattering from charged surface states, impurities, and surface opticalphonons; degrading the transport properties of graphene. Hexagonal boron nitride (h-BN) exhibits an atomically smoothsurface that is expected to be free of dangling bonds, leading to an interface that is relatively free of surface charge trapsand adsorbed impurities. Additionally, the decreased surface optical phonon interaction from h-BN is expected to furtherreduce scattering. While h-BN gated graphene FETs have been demonstrated on a small scale utilizing CVD grown orexfoliated graphene, integrating quasi-freestanding epitaxial graphene (QFEG) with h-BN gate dielectrics on a waferscale has not been explored. We present results from the first large scale CVD growth of h-BN and its subsequenttransfer to a 75mm QFEG wafer. The effects of growth conditions on the thickness and quality of the h-BN film and itspotential and limitations as a gate dielectric to QFEG are discussed. The introduction of charged impurities during thetransfer process resulted in an average degradation in mobility of only 9%. Despite the slight degradation, we show thath-BN is highly beneficial compared to high-k dielectrics when the charged impurity concentration of QFEG is below5x10sup12/supcmsup-2/sup. Here we show improvements in mobility of &3x and intrinsic cutoff frequency of &2x compared to HfOsub2/sub.© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
机译:基于石墨烯的电子产品的关键限制是石墨烯与介电界面的相互作用。 SiO 2 和各种高k栅极电介质会从带电的表面态,杂质和表面光子引入散射。降低石墨烯的传输性能。六方氮化硼(h-BN)表现出原子上光滑的表面,预期没有悬空键,从而导致界面上相对没有表面电荷陷阱和吸附的杂质。另外,预期来自h-BN的降低的表面光学声子相互作用将进一步减少散射。虽然已经利用CVD生长或剥落的石墨烯在小规模上证明了h-BN栅石墨烯FET,但尚未探索将准独立式外延石墨烯(QFEG)与h-BN栅电介质在晶圆级集成。我们介绍了h-BN首次大规模CVD生长及其随后转移到75mm QFEG晶片的结果。讨论了生长条件对h-BN薄膜厚度和质量的影响及其作为QFEG栅极电介质的潜力和局限性。在转移过程中带电杂质的引入导致迁移率的平均下降仅为9%。尽管性能略有下降,但我们证明,当QFEG的带电杂质浓度低于5x10 12 cm -2 时,h-BN与高k电介质相比具有很高的优势。在这里,我们显示出与HfO 2 相比,迁移率提高了3倍以上,固有截止频率提高了2倍以上。©(2012)光电仪器工程师学会(SPIE)版权所有。摘要的下载仅允许个人使用。

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