首页> 外文会议>ASME conference on smart materials, adaptive structures and intelligent systems 2008 >ACTIVE VIBRATION CONTROL AND ISOLATION FOR MICRO-MACHINED DEVICES
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ACTIVE VIBRATION CONTROL AND ISOLATION FOR MICRO-MACHINED DEVICES

机译:微机械设备的主动振动控制和隔离

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摘要

Some harsh environments contain high frequency, high amplitude mechanical vibrations. Unfortunately some very useful components, such as MEMS gyroscopes, can be very sensitive to these high frequency mechanical vibrations. Passive micromachined silicon lowpass filter structures (spring-mass-damper) have been demonstrated in recent years. However, the performance of these filter structures is typically limited by low damping. This is especially true if operated in low pressure environments, which is often the optimal operating environment for the attached device that requires vibration isolation. An active micromachined vibration isolator can be realized by combining a state sensor, and electrostatic actuator and feedback electronics with the passive isolator. Using this approach, a prototype active micromachined vibration isolator is realized and used to decrease the filter Q from approximately 135 to approximately 60, when evaluated in a low pressure environment. The physical size of these active isolators is suitable for use in or as packaging for sensitive electronic and MEMS devices, such as MEMS vibratory gyros.
机译:一些恶劣的环境包含高频,高振幅的机械振动。不幸的是,某些非常有用的组件(例如MEMS陀螺仪)可能会对这些高频机械振动非常敏感。近年来已经证明了无源微加工硅低通滤波器结构(弹簧质量阻尼器)。然而,这些滤波器结构的性能通常受到低阻尼的限制。如果在低压环境中操作尤其如此,而低压环境通常是需要隔离振动的连接设备的最佳操作环境。有源微机械隔振器可以通过将状态传感器,静电致动器和反馈电子设备与无源隔振器结合使用来实现。使用这种方法,可以实现原型有源微机械隔振器,并在低压环境下进行评估时,可将其从约135降低到约60。这些有源隔离器的物理尺寸适合用于或用作敏感电子和MEMS设备(例如MEMS振动陀螺仪)的包装。

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