Research on Quick Polishing of CVD Diamond Film

摘要

Polycrystalline CVD diamond film possesses many advanced physical and mechanical properties which makes it a very important engineering material. However, high hardness value and extreme brittleness have made CVD diamond film a very difficult material to be machined by conventional grinding and polishing processes. In the present research, diamond wafers were pre-treated with RIE in an attempt to weaken the top layer and pave the way for subsequent thermo-chemically polishing. It was found that the diamond grains were anisotropically etched and some high aspect ratio pillar-like micro-structures were formed during the RIE process. These micro-pillars are relatively easy to be ruptured and removed by the subsequent polishing process. The results showed that this method could effectively speed up the polishing of CVD diamond films.