A glass solder process for packaging fibre optic components

摘要

A novel glass solder process has recently been developed for making a glass-to-glass bond between optical fibers and a silica substrate. Test results show that this bond is significantly stronger than epoxy bonds and is not susceptible to degradation from humidity. This glass solder technique is inexpensive, fast and can be readily incorporated into the manufacturing process of couplers with significant improvement in component reliability