DEVELOPMENT AND SLICING PERFORMANCE OF HIGH ACCURACY MULTI-WIRE SAW: EFFECT OF TABLE FEED ACCURACY AND THERMAL DEFORMATION OF FRAME ON SLICING ACCURACY

摘要

In the development of a high accuracy wire saw capable of producing high-quality wafers, attention was focused on table straightness andframe thermal deformation, and by implementing countermeasures for these, slicing accuracy was improved. (1) The table feed accuracy is closely connected to the warp accuracy, and by enhancing the straightness of the table guides, we improved the undulation components. (2) We made clear the frame's thermal deformation characteristic, and by employing low thermal expansion materials, we improved the thermal deformation characteristic.