首页> 外文会议>American Society for Precision Engineering Annual Meeting; 20051009-14; Norfolk,VA(US) >Micro Grinding Blind Holes in Hard Tungsten Carbide with Polycrystalline Diamond Micro Tools
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Micro Grinding Blind Holes in Hard Tungsten Carbide with Polycrystalline Diamond Micro Tools

机译:用多晶金刚石微型工具在硬质碳化钨中微研磨盲孔

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摘要

This paper describes a micro hole drilling technique using micro electro-discharge machining (μEDM) and poly-crystalline diamond (PCD) micro tools to improve the precision of holes drilled in hard tungsten carbide. A two-step technique is described for achieving faster, more precise and accurate holes. First, the hole is drilled with μEDM using tungsten electrodes shaped by WEDG. Next, the holes are improved by grinding with PCD micro tools, which are also shaped by WEDG. It is found that holes fabricated with PCD micro tools are superior since they have less heat-affected zone, exhibit improved surface finish, and have less form error. Also, the hole size is more accurately controlled with PCD tools, since no gap exists between the tool and workpiece and because tool wear is less than electrode wear during μEDM.
机译:本文介绍了一种使用微放电加工(μEDM)和多晶金刚石(PCD)微型工具的微孔钻孔技术,以提高在硬质碳化钨中钻孔的精度。描述了一种用于实现更快,更精确和更精确的孔的两步技术。首先,使用由WEDG制成的钨电极在μEDM上钻孔。接下来,通过用PCD微型工具磨削来改进孔,该工具也由WEDG成型。已发现用PCD微型工具制造的孔具有优越的性能,因为它们的热影响区更少,表面光洁度更高,而且形状误差也较小。此外,由于PCD工具不存在间隙,并且在μEDM期间工具磨损小于电极磨损,因此可以使用PCD工具更精确地控制孔的尺寸。

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