DESIGN OF AIR AND LIQUID COOLING SYSTEMS FOR ELECTRONIC COMPONENTS USING CONCURRENT SIMULATION AND EXPERIMENT

摘要

The design of cooling systems for electronic equipment is getting more involved and challenging due to increase in demand for faster and more reliable electronic systems. Therefore, robust and more efficient design and optimization methodologies are required. Conventional approaches are based on sequential use of numerical simulation and experiment. Thus, they fail to use certain advantages of using both tools concurrently. The present study is aimed at combining simulation and experiment in a concurrent manner such that outputs of each approach drives the other to achieve better engineering design in a more efficient way. In this study, a relatively simple problem involving heat transfer from multiple heat sources, simulating electronic components, located in a horizontal channel was investigated experimentally and numerically. Two experimental setups were fabricated for air and liquid cooling experiments to study the effects of different coolants. De-ionized water was used as the liquid coolant in one case and air in the other. The effects of separation distance and flow conditions on the heat transfer and fluid flow characteristics were investigated in details for both coolants. Cooling capabilities of different cooling arrangements were compared and the results from simulations and experiments were combined to provide quantitative inputs for the design. The domains over which experimental or the numerical approach is superior to the other are determined. Simulations are used to guide the experiments and vice versa It is found that the proposed optimization methodology can be implemented in the design of cooling systems for electronic components for faster and more efficient convergence. This methodology can also be extended to more complex and practical electronic systems.