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Reductions in the Thickness of Gold Layers For Connector Applications by Utilizing Undercoats of Electrolytic Nickel Phosphorous Alloys

机译：通过使用电解镍磷合金的底涂层减少用于连接器的金层厚度

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《AESF SUR/FIN 2002》|2002年|p.493-499|共7页
会议地点 Chicago IL(US)
作者
Steve Burling; Mike Wild; Sandra Teague; Christian Leclere;
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作者单位

Engelhard-CLAL UK Ltd., Valley Road, Cinderford, Gloucestershire. GL14 2PB. Telephone +44(0) 1594 822181;

Engelhard-CLAL UK Ltd, Cinderford, Gloucestershire, UK;

Engelhard-CLAL UK Ltd, Cinderford, Gloucestershire, UK;

Engelhard-CLAL, Noisy Le Sec, France;

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原文格式 PDF
正文语种 eng
中图分类电镀工业;
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Reductions in the Thickness of Gold Layers For Connector Applications by Utilizing Undercoats of Electrolytic Nickel Phosphorous Alloys

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