Reducing bubbles and particles associated with photoresist packaging materials and dispense systems

摘要

A review of bubble energetics is presented to provide background into gas saturation and bubble formation in semiconductor resists. Nitrogen was used as a drive gas to push liquid out of several package materials versus a mechanical pump. The incorporation of dissolved gas was measured and a barrier liner was found to be superior versus a bottle with no liner. We have demonstrated that a pressure dispense package with an appropriate barrier liner provides a means to deliver lithographic chemicals and resist without the use of a mechanical pump.