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Parameter Investigation of PEB sensitivity

机译:PEB敏感性的参数研究

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Post exposure bake temperature sensitivity (PEB sensitivity) becomes important as the pattern pitch size shrinks gradually. There are several factors affecting the PEB sensitivity including acidity and diffusion of photogenerated acid, activation energy for deprotection reaction, free volume of base polymer, and so on. Our works were conducted as a part of the basic study for searching influential parameter of PEB sensitivity. We found that PEB sensitivity relies largely on not only acid diffusion parameter, but also the hydrophilicity of base polymer and protection group ratio. Also, we observed that bulkiness of deprotection group has great influence on PEB sensitivity. Detailed results will be reported in this paper.
机译:随着图案间距尺寸逐渐缩小,曝光后烘烤温度敏感性(PEB敏感性)变得很重要。影响PEB敏感性的因素有很多,包括酸度和光生酸的扩散,脱保护反应的活化能,基础聚合物的自由体积等。我们的工作是作为研究PEB敏感性影响参数的基础研究的一部分而进行的。我们发现,PEB的敏感性不仅主要取决于酸的扩散参数,而且还取决于基础聚合物的亲水性和保护基团的比例。此外,我们观察到,脱保护基的庞大度对PEB敏感性有很大影响。详细结果将在本文中报告。

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